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深圳市精鉆電路板有限公司
打造專業性價比優質的線路板生產商
服務熱線：
0755-27595539
| NO | 項目items | 制程能力Capabilities | |
| 1 | 層數 | Layer Counts | 2-16 |
| 2 | 最大拼板尺寸 | Max pannel size | 22"x32"(558mmx812mm) |
| 3 | 最小線寬/線隙 | Min line space/width | 3mil/3mil(0.075mm/0.075mm) |
| 4 | 最小內號焊盤 | Mininner layer PAD | 4mil(0.1mm) |
| 5 | 最薄內層厚度 | Mininner layer thick | 4mil(0.1mm) |
| 6 | 內銅箔厚度 | Irner layer Cu thick | 0.5-2.0 oz |
| 7 | 孔銅厚度 | Hole wall thusck | 18-30um |
| 8 | 無鉛噴錫錫厚 | HAL (lead free)tinthick | 150-1000u"(3.75-25um) |
| 9 | 外層完成銅厚 | Outlayer Cuthick | 0.5-2.0 oz |
| 10 | 完成板厚 | Board thick range | 0.4-5.0mm |
| 11 | 板厚公差 | Board thick tolerance | ±10% |
| 12 | 多層板層間對準度 | Stackup alignment | ±2mi1(±50um) |
| 13 | 最小鉆孔孔徑 | Min drill hole | 0.1mm |
| 14 | 于L位精度 | Hole to hole position | ±2mil(±50um) |
| 15 | 孔徑公差 | Hole tolerance | ±1mil(±25um) |
| 16 | 孔電鍍最大縱橫比 | Throughhole aspect ratio | 10:01 |
| 17 | 外層PAD對位精度 | PAD alignment accuracy | 3mil/3mil(0.075mm/0.075mm) |
| 18 | 蝕刻公差 | Etching tolerance | ±10% |
| 19 | 阻焊橋最小保留寬度 | Min soldermask bridge | 3mil(0.075mm) |
| 20 | 阻焊塞油最大孔徑 | Max.plug via hole | 0.5mm |
| 21 | 表面處理工藝 | Surface treatment Capabilities |
HAL、ENIG、OSP、Carbonink、Gold finger、immersiontin、lmmersionsilver |
| 22 | 金手指最大鍍金厚度 | Max hard gold thick | ≤100u"(≤2.5um) |
| 23 | 沉鎳金厚度 | ENIG thick | 1-3 UM" |
| 24 | 阻抗控制公差 | Impedance tolerance | ±10% |
| 25 | 最大扭曲度 | Max.twist & warp | ≤0.75% |
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